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Behind the cheers of the shooting of American medical insurance executives: blood-sucking insurance companies and the new threat of "ghost guns", the suspect who shot and killed a senior executive of an American medical insurance company in the streets of new york City was arrested on the 9th. Police said on the 11th that a number of evidences have confirmed the criminal facts of suspect Luigi Man Ghione. After the shooting, the American public's anger against medical insurance companies broke out on the Internet, and the "ghost gun" 3D printed pistol used by the suspect also showed that the problem of gun proliferation in the United States became increasingly difficult to solve. Agence France-Presse reported that since Thompson was shot, the voice of ridicule and satire has flooded the Internet, and the lack of sympathy has become the mainstream sentiment of the public, which reflects the dissatisfaction and anger of Americans towards the medical system. (CCTV)The CSI convertible bond index closed up by 0.46% at noon, while the auto model convertible bond, the alliance convertible bond and the profit convertible bond rose by 15.85%, 13.27% and 11.35% respectively. Tianyuan convertible bonds fell by 15.28% and Yingtong convertible bonds fell by 5.30%.Daiwa Capital Market raised the target price of Tesla from $285 to $420.

Black hand again! The United States will raise import tariffs on solar polysilicon, silicon wafers and some tungsten products in China from the beginning of next year. The Office of the US Trade Representative issued a statement saying that the United States will raise import tariffs on solar polysilicon, silicon wafers and some tungsten products imported from China from the beginning of next year after a four-year review by the Biden administration. The tariff rate of silicon wafer and polysilicon will be increased to 50%, and the tariff rate of some tungsten products will be increased to 25%. These tariff increases will take effect on January 1, 2025. (Cailian)Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)Chinese brokerage stocks in Hong Kong stocks rose by more than 13%, while Chinese brokerage stocks in Hong Kong stocks rose by more than 13%, China Merchants Securities rose by more than 6%, and Everbright Securities, CITIC Securities, CICC and china galaxy followed suit.

By 11:30, 100 stocks in the two cities had daily limit.Thailand's consumer confidence index rose to 56.9 in November, boosted by stimulus measures, and Thailand's consumer confidence index rose from 56.0 to 56.9 in November.Shanghai Nickel's main contract has expanded, and now it has risen by more than 3% to 129,170 yuan/ton.